Heidelberg Connect spotlights the future of print and packaging

Heidelberg India hosted HEI Connect, its flagship industry conference, at the Taj Santacruz in Mumbai on 29 January 2026, bringing together global eadership, brand owners, converters, printers, packaging professionals and academic institutions to examine growth opportunities, market realities and the future direction of the Indian print and packaging sector

by Noel D'Cunha