CII to host Packaging Expo and Conference from 18-25 May

According to the organiser, this event intends to transform the packaging sector by enabling the exchange of ideas, fostering dialogues and creating strong linkages. It is set to cover varied aspects of the packaging ecosystem such as the need and impact of the anti-dumping regulations and tariff barriers on imports and processing, sustainability and innovations in recycling among other topics.

“With Breaking Barriers, Bridging Gaps as its central theme, the conference is slated to cover concepts that focus on a broad spectrum of opportunities, challenges and best practices. The event will enable the leaders to engage in discussions that promote inclusive growth,” said a press note shared with WhatPackaging?.   

It added, “It will also create a dynamic, reliable and conducive platform for the convergence of all the stakeholders to forge the strategies for the inclusive growth. And bring together the best in the packaging sector.”

The event will be conducted on the organisation’s in-house platform, CII Hive under the chairmanship of Piruz Khambatta, chairman and managing director, Rasna. The Expo and Conference is supported by Tinplate Corporation of India, Aquachill, Sigma Capseal, EPL, Electronics Devices, UFlex, Indian Institute of Packaging (IIP) and Plastics Machinery Manufacturers Association of India.

Click here to register for the eight-day event.