Advanced packaging market expected to cross USD 57.67-billion by 2026

The scope for advanced packaging has brought a paradigm shift in the chip manufacturing sector and is anticipated to bring huge transformation semiconductor fabrication methods. So, advanced packaging developed as a means of improving device performance while shrinking packages at the same time. Traditional packaging encapsulated each individual chip, requiring more weight in exchange for even more instability. These advanced packaging technologies are the combination of various techniques such as 2.5D, 3D-IC, wafer-level packaging, and many others. This facilitates in the integrated circuits, to enclose in the case which prevents the corrosion of the metallic parts and physical damage. The packaging techniques used to rely on various parameters such as power consumption and operating conditions. These technologies are widely used in the industrial and automotive sectors. In addition to this, large-scale acceptance of next-gen semiconductor tool is predicted to scale up the use of myriad advanced packaging methods, thereby steering the industry development technology.

Global advanced packaging market report is segmented on the basis of product type, application, and region and country level. Based on product type, global advanced packaging market is classified as the 3D integrated circuit, 2D integrated circuit, 2.5D Integrated Circuit, wafer level chip scale package, flip chip, fan out silicon in package and fan out wafer lever package. Based upon application, global advanced packaging market is classified into automotive, computers, communications, LED, healthcare and others.

The regions covered in this advanced packaging market report are North America, Europe, Asia-Pacific and rest of the world. On the basis of country level, market of advanced packaging is sub-divided into US, Mexico, Canada, UK, France, Germany, Italy, China, Japan, India, South East Asia, GCC, Africa, etc.

Key players include ASE, UTAC, Stats Chippac, Amkor, J-Devices, SPIL, Chipbond, JCET, PTI, Chipmos, Walton, AOI, STS, NEPES, Unisem, Carsem, Huatian, Formosa, OSE, NFM and others.