PackPlus 2019: Bostik showcases cutting edge technology solutions

By 30 Aug 2019

Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, is showcasing its products and technology for the packaging industry PackPlus 2019.

The Bostik stall at PackPlus 2019

With over 100 years of experience in the adhesives industry and having been present in Asia for more than 30 years, according to Bostik, the company understands the challenges faced by customers and develops innovative adhesives solutions that are smarter and more adaptable. As a pioneer in flexible packaging technologies, Bostik’s customised solutions with cutting edge packaging technology meets the most demanding packaging applications.

Solutions showcased at the Bostik booth during PackPlus include laminating adhesives, cold seal adhesives and reseal adhesives.

Laminating adhesives cover the full range of laminating applications with solvent and solvent-free products to meet any flexible packaging needs, from snack and confectionary packaging, beverage packaging, to personal care, household and retort packing.

Reseal adhesives eliminate the need for secondary packaging (such as zippers) while preserving food freshness, improving your product performance and operational efficiencies. They provide a less wasteful, more environmentally friendly and easier to use alternative to conventional non-resealable containers.

Vitel heat seal solutions enable lidding films with peelable seal to be placed directly over recyclable mono-material PET trays. Bostik’s Vitel heat seal come with built-in anti-fog functionality, avoiding the need for a dedicated additional lacquer.

Cold seal adhesives are uniquely designed to improve product’s performance, operational efficiencies and aesthetics, especially for confectionary (chocolate), bakery, nutrition bars and other special packaging. As pioneers in cold seal technology with our Turbo-Seal platform, Bostik has been a leading cold seal supplier for more than 35 years.

According to a recent report by research from PC Wood Mackenzie, demand for flexible packaging in the Indian market is estimated to grow at nearly 10% a year over the next five years, estimated at USD 5.6 billion in 2017.

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